Semiconductor device and method for manufacturing same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8816437
APP PUB NO 20130146879A1
SERIAL NO

13703987

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Abstract

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Disclosed is a semiconductor device in which an n-channel type first thin film transistor and a p-channel type second thin film transistor are provided on the same substrate. The first thin film transistor has a first semiconductor layer (11), and the second thin film transistor has a second semiconductor layer (20), a third semiconductor layer (21), and a fourth semiconductor layer (22). The first semiconductor layer (11), the second semiconductor layer (20), the third semiconductor layer (21) and the fourth semiconductor layer (22) are formed of the same film, and the first and second semiconductor layers (11, 20) respectively have slanted portions (11e, 20e) positioned at respective peripheries, and main portions (11m, 20m) made of portions other than the slanted portions. A p-type impurity is implanted into the slanted portion (11e) of the first semiconductor layer at a concentration higher than that in the main portion (11m) of the first semiconductor layer and that in the main portion (20m) of the second semiconductor layer.

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Patent Owner(s)

Patent OwnerAddress
SHARP KABUSHIKI KAISHA1 TAKUMI-CHO SAKAI-KU SAKAI CITY OSAKA 5908522 ?5908522

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hotta, Kazushige Osaka, JP 38 307
Yamanaka, Masaki Osaka, JP 78 183

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