Structure for reducing integrated circuit corner peeling
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United States of America Patent
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Sep 16, 2014
Grant Date -
Jun 13, 2013
app pub date -
Feb 11, 2013
filing date -
Jul 29, 2008
priority date (Note) -
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Abstract
A crack prevention structure that reduces integrated circuit corner peeling and reduces cracking is disclosed. The crack prevention structure comprises a semiconductor substrate; a first plurality of dielectric layers of a first material disposed over the semiconductor substrate; a second plurality of dielectric layers of a second material different than the first material, disposed on the first plurality of dielectric layers, wherein the first plurality of dielectric layers and the second plurality of dielectric layers meet at an interface; and a plurality of metal structures and a plurality of via structures formed through the interface of the first plurality of dielectric layers and the second plurality of dielectric layers.
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