Circuit probing structures and methods for probing the same

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United States of America Patent

PATENT NO 9129973
APP PUB NO 20130147049A1
SERIAL NO

13313907

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Abstract

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A package component includes a stack-probe unit, which includes a first-type connector, and a second-type connector connected to the first-type connector. The first-type connector and the second-type connector are exposed through a surface of the package component.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Hao Luzhou, TW 1012 6150
Lin, Hung-Chih Hsin-Chu, TW 117 1212
Peng, Ching-Nen Hsin-Chu, TW 50 416
Wang, Mill-Jer Hsin-Chu, TW 85 602

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