Casing structure for electronic devices
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United States of America Patent
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Nov 5, 2013
Grant Date -
Jun 13, 2013
app pub date -
Feb 12, 2013
filing date -
Jan 11, 2008
priority date (Note) -
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status (Latency Note)
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Abstract
An aspect provides a method, including: fixing a laminated panel, which has been cut into a predetermined shape, to a mold, said laminated panel having an expanded layer disposed between layers made of a conductive resin; injection of molding non-conducting resin into the mold in which the laminated panel has been fixed; wherein a non-conductive region and a conductive region are joined to form a bottom surface of a display casing, said display casing having an inner and outer surface; and wherein an antenna mounting space is formed in the non-conductive region. Other aspects are described and claimed.
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