Imprinting stamp and nano-imprinting method using the same

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United States of America Patent

PATENT NO 9360751
APP PUB NO 20130147096A1
SERIAL NO

13617874

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Abstract

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An imprinting stamp and a nano-imprinting method using the imprinting stamp are provided. The imprinting stamp includes a first substrate; one or more field regions on the first substrate, the first substrate including nano-patterns; and a first dummy pattern region on the first substrate and adjacent to the field region, the dummy pattern region including first dummy patterns having greater dimensions than that of the nano-patterns, the first dummy patterns being a plurality of polygons, each of the polygons having a vertex pointing in a first direction proceeding from the field region toward the first dummy pattern region.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRONICS CO LTDSUWON-SI GYEONGGI-DO 16677

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kim, Jae-kwan Daejeon, KR 22 122
Ko, Woong Hwaseong-si, KR 15 59
Lee, Byung-kyu Seoul, KR 38 251
Lee, Du-hyun Suwon-si, KR 17 85
Yang, Ki-yeon Seongnam-si, KR 6 11

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