Liquid Cooled Planer
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United States of America Patent
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Issued Date -
Jun 13, 2013
app pub date -
Dec 12, 2011
filing date -
Dec 12, 2011
priority date (Note) -
Published
status (Latency Note)
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Abstract
A liquid cooled planer including: one or more computing components mounted on the planer, wherein at least one or more of the computing components is liquid cooled; one or more conductive cooling components mounted on the planer; and one or more convective cooling components mounted on the planer, wherein the convective cooling components are removable from the planer without removing the conductive cooling components from the planer.
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