Reduction of arc-tracking in chip on flexible circuit substrates
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United States of America Patent
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Sep 10, 2013
Grant Date -
Jun 13, 2013
app pub date -
Dec 7, 2011
filing date -
Dec 7, 2011
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Abstract
A flexible circuit substrate has an integrated circuit mounted on the substrate, a first set of traces arranged to connect between a first voltage source and a first set of connectors on the integrated circuit, a second set of traces arranged to connect between a second voltage source and a second set of connectors on the integrated circuit, and a gap in the flexible circuit substrate between the first and second set of traces, the gap of sufficient width to stop an electrical arc-tracking between the first set of traces and the second set of traces. The substrate may have a second gap between the first gap and other traces.
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