DOUBLE-LAYER PCB OF LOW POWER WIRELESS SENSING SYSTEM AND MANUFACTURING METHOD
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United States of America Patent
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Issued Date -
Jun 13, 2013
app pub date -
Jun 14, 2012
filing date -
Dec 9, 2011
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The invention discloses a double-layer PCB of a low power wireless sensing system and a manufacturing method thereof. The low power wireless sensing system includes a first layer and a second layer. The first layer comprises a wireless communication module, a power amplifying module, a USB module, a balun module, an antenna module, a low-frequency oscillator and a high-frequency oscillator. According to the double-layer PCB of the low power wireless sensing system and the manufacturing method thereof, a circuit layout can be performed on the double-layer PCB to reduce volume of the PCB.
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