Systems and methods for stacked semiconductor memory devices
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United States of America Patent
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Jul 15, 2014
Grant Date -
Jun 13, 2013
app pub date -
Dec 7, 2011
filing date -
Dec 7, 2011
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Abstract
Systems and methods are provided for stacked semiconductor memory devices. The stacked semiconductor memory devices can include a nonvolatile memory controller, a number of nonvolatile memory dies arranged in a stacked configuration, and a package substrate. The memory controller and the memory dies can be coupled to each other with vias that extend through the package substrate. A vertical interconnect process may be used to electrically connect the nonvolatile memory dies to each other, as well as other system components. The memory controller may be flip-chip bonded to external circuitry, such as another semiconductor device or a printed circuit board.
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