Interface structure for copper-copper peeling integrity
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 26, 2013
Grant Date -
Jun 13, 2013
app pub date -
Dec 27, 2012
filing date -
Dec 8, 2009
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An integrated circuit device is disclosed. An exemplary integrated circuit device includes a first copper layer, a second copper layer, and an interface between the first and second copper layers. The interface includes a flat zone interface region and an intergrowth interface region, wherein the flat zone interface region is less than or equal to 50% of the interface.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully