Chemical vapor deposition film profile uniformity control
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United States of America Patent
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Dec 23, 2014
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app pub date -
Dec 7, 2011
filing date -
Dec 7, 2011
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Abstract
The present disclosure provides for methods and systems for controlling profile uniformity of a chemical vapor deposition (CVD) film. A method includes depositing a first layer on a substrate by CVD with a first shower head, the first layer having a first profile, and depositing a second layer over the first layer by CVD with a second shower head, the second layer having a second profile. The combined first layer and second layer have a third profile, and the first profile, the second profile, and the third profile are different from one another.
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