Solar Cell Flip Chip Package Structure and Method for Manufacturing the same
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United States of America Patent
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Issued Date -
Jun 20, 2013
app pub date -
Dec 20, 2011
filing date -
Dec 20, 2011
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present invention provides a solar cell flip chip package structure, comprising: a substrate having a first surface, a second surface and an opening extending from the first surface to the second surface; a conducting layer disposed on the first surface of the substrate; a solar cell flip chip bonded on the conducting layer; a transparent layer attached on the second surface of the substrate; and a storage space formed between the opening extending from the first surface to the second surface, the solar cell flip chip and the transparent layer.
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