Process for Hybrid Integration of Focal Plane Arrays
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United States of America Patent
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Issued Date -
Jun 20, 2013
app pub date -
Nov 19, 2012
filing date -
Nov 17, 2011
priority date (Note) -
Abandoned
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Abstract
A method for aligning a first substrate relative to a second substrate by enabling reflow of low-melting-temperature solder bumps is disclosed. Reflow of the solder bumps induces a force that moves one substrate relative to the other to improve alignment accuracy between bond pads located on each substrate. The method further enables reduction of surface oxide on the solder bumps that would otherwise inhibit reliable solder joint formation.
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