Hermetic Semiconductor Package Structure and Method for Manufacturing the same
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United States of America Patent
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Issued Date -
Jun 20, 2013
app pub date -
May 10, 2012
filing date -
Dec 19, 2011
priority date (Note) -
Abandoned
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Abstract
The invention provides a semiconductor package structure, comprising: a substrate having a first surface and a second surface; a first conductive layer plated on the first surface; a semiconductor element attached to the first conductive layer on the first surface of the substrate for electrically connecting; a second conductive layer plated on the first surface and surrounded the semiconductor element and the first conductive layer, wherein the height of the second conductive layer is higher than the first conductive layer; and a lid attached to the top of the second conductive layer for sealing the semiconductor element.
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