TRANSPARENT CONDUCTIVE- AND ITO-REPLACEMENT MATERIALS AND STRUCTURES
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United States of America Patent
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Issued Date -
Jun 20, 2013
app pub date -
Oct 25, 2012
filing date -
Oct 28, 2011
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Provided herein are methods comprising (i) depositing an ink on a surface, (ii) producing a conductive metal film by, for example, heating or irradiating or other treatment of said ink, and (iii) wherein the metal film is in the form of a repetitively patterned structure forming a grid-like network of vertex-shared polygons and polygon-like structures with a varying number of vertices. Transparent, conductive structures can be formed and serve as, for example, ITO-replacement materials and structures.
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