EPOXY RESIN COMPOSITION AND ITS PREPARING METHOD
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United States of America Patent
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Issued Date -
Jun 20, 2013
app pub date -
Jun 3, 2011
filing date -
Jun 4, 2010
priority date (Note) -
Abandoned
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Abstract
The invention relates to an epoxy resin composition and preparation thereof. The composition comprises the following blended components: 100 weight parts of epoxy resins; 30 to 120 weight parts of anhydride curing agents; 1 to 45 weight parts of powdery nitrile rubbers; no curing accelerator is included in the composition. The composition of the invention has both higher heat resistance and higher toughness, and is suitable for the fields which require high heat resistance, such as circuit board, electronics packaging, binder and electrical insulating coating etc.
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