LIGHT EMITTING DIODE PACKAGES AND METHODS OF MAKING
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United States of America Patent
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Issued Date -
Jun 27, 2013
app pub date -
Dec 23, 2011
filing date -
Dec 23, 2011
priority date (Note) -
Abandoned
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Abstract
Light emitting, diode (LED) packages and processes with improved heat dissipation. In certain embodiments, only metal solder resides in the space between the leadframe and the circuit board, providing good heat conduction from the LED chip to the circuit board. In certain embodiments, sidewalls of the leadframe are tilted to provide improved light emission.
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