COPPER-ELECTROPLATING COMPOSITION AND PROCESS FOR FILLING A CAVITY IN A SEMICONDUCTOR SUBSTRATE USING THIS COMPOSITION

United States of America Patent

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Issued Date
Jul 4, 2013
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Jun 9, 2011
filing date
Jun 11, 2010

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Abandoned

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Abstract

The subject-matter of the present invention is a composition especially intended for filling, by the electroplating of copper, a cavity in a semiconductor substrate such as a “through-via” structure for the production of interconnects in three-dimensional integrated circuits.

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Patent Owner	Address
ALCHIMER	15 RUE DU BUISSON AUX FRAISES Z I DE LA BONDE MASSY 91300

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C25D:PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC ....

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Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Frederich, Nadia	Trets, FR	2	9
Gonzalez, José	Lombez, FR	7	19
Raynal, Frédéric	Paris, FR	5	20

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COPPER-ELECTROPLATING COMPOSITION AND PROCESS FOR FILLING A CAVITY IN A SEMICONDUCTOR SUBSTRATE USING THIS COMPOSITION

Number of patents in Portfolio can not be more than 2000

United States of America Patent

13703515

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13703515

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