DEVICE FOR CUTTING A SUBSTRATE AND METHOD FOR CONTROLLING SUCH A CUTTING DEVICE
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United States of America Patent
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N/A
Issued Date -
Jul 18, 2013
app pub date -
Dec 21, 2012
filing date -
Dec 23, 2011
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A device for cutting a substrate along a cutting line is disclosed. The device includes a saw unit with a saw blade, which can be rotated around an axis of rotation, a guide carriage for moving the saw unit along a guide rail, and a control device for controlling the saw unit and the guide carriage. A marking device is provided for marking an end point of the cutting line.
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