NANOSCALE, ULTRA-THIN FILMS FOR EXCELLENT THERMOELECTRIC FIGURE OF MERIT
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United States of America Patent
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Issued Date -
Jul 18, 2013
app pub date -
Dec 21, 2012
filing date -
Nov 22, 2011
priority date (Note) -
Abandoned
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Abstract
A thermoelectric structure including a thermoelectric material having a thickness less than 50 nm and a semi-insulating material in electrical contact with the thermoelectric material. The thermoelectric material and the semi-insulating materials have an equilibrium Fermi level, across a junction between the thermoelectric material and the semi-insulating material, which exists in a conduction band or a valence band of the thermoelectric material. The thermoelectric structure is for thermoelectric cooling and thermoelectric power generation.
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