HEAT SINK BIMETALLIC PILLAR BUMP AND THE LED HAVING THE SAME
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United States of America Patent
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Issued Date -
Jul 25, 2013
app pub date -
Jan 18, 2013
filing date -
Jan 19, 2012
priority date (Note) -
Abandoned
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Abstract
The invention relates to a heat sink bimetallic pillar bump that is mainly disposed inside of a LED. The heat sink bimetallic pillar bump comprises a heat absorbing section composed of a first metal and a heat dissipating section firmly connected with the heat absorbing section. The heat dissipating section is composed of a second metal. The first metal has a thermal conductivity greater than that of the second metal. The LED chip is disposed on the heat absorbing section. The heat absorbing section with high thermal conductivity quickly transfers the heat generated by the LED chip to the heat dissipating section. This makes the heat from the LED chip to be dissipated quickly, which therefore achieves purposes of improving the heat dissipation efficiency of the LED and other kinds of IC chips and prolonging the lifespan of the LED and other kinds of IC chips.
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