HEAT TRANSFER SUBSYSTEM INTERCONNECTION ARRANGEMENTS FOR INFORMATION TECHNOLOGY
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United States of America Patent
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app pub date -
Nov 15, 2012
filing date -
Feb 16, 2011
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Abstract
Arrangements for heat transfer subsystem interconnection for use in information technology and other heat-producing equipment are disclosed. The arrangements provide for plurality of individual subsystems, each having a thermal interface. These are configured so that two or more of the subsystems can be thermally interconnected by connecting their thermal interfaces. Each subsystem may comprise at least one thermoelectric device capable of acting as a thermoelectric cooler and as a thermoelectric generator. The thermoelectric device can incorporate quantum-process and quantum-well materials for higher heat transfer and thermoelectric generation efficiencies. In some implementations, the thermoelectric device is comprised by the thermal interface. In some implementations, a control system and electronics are used to selectively configure the thermoelectric device in either a thermoelectric cooler operating mode or in a thermoelectric generation operating mode.
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