SMALL FORM FACTOR MICROFUSED SILICON STRAIN GAGE (MSG) PRESSURE SENSOR PACKAGING
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United States of America Patent
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Issued Date -
Aug 1, 2013
app pub date -
Jan 15, 2013
filing date -
Jan 27, 2012
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A pressure sensor assembly includes a base including a radially offset pressure port. An electronics package may be included within a housing generally alongside the offset pressure port. Accordingly, the pressure sensor assembly exhibits a substantially smaller diameter than previously achieved. Methods of fabrication are provided.
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