FLUX COMPOSITIONS FOR FORMING A SOLDER BUMP AND METHODS OF FABRICATING A SEMICONDUCTOR DEVICE USING THE SAME

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United States of America Patent

APP PUB NO 20130192722A1
SERIAL NO

13754008

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Abstract

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The inventive concept provides flux compositions for forming a solder bump and methods of fabricating a semiconductor device using the same. The flux composition may include a resin, an activator, and a solvent. The resin may include gum rosin and rosin ester, and a mass ratio of the gum rosin versus the rosin ester may have a range of about 60:40 to about 90:10.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRONICS CO LTDGYEONGGI DO ROAD SOUTH KOREA SAMSUNG SUWON CITY LINGTONG DISTRICT NO 129 SUWON GYEONGGI-DO
DONGWOO FINE-CHEM CO LTDJEONBUK SOUTH KOREA GYEONGSANGBUK-DO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ahn, Seunghyun Suwon-si, KR 9 19
Cho, Kyoochul Yongin-si, KR 5 11
Kang, Dong-Min Seoul, KR 45 305
Kang, Ingoo Yongin-si, KR 5 14
Kim, Sang Tae Iksan-si, KR 44 121
Kim, Sunghoon Iksan-si, KR 400 3449
Kim, Taesung Hwaseong-si, KR 150 1074
Myung, Jungjae Iksan-si, KR 1 2
Song, In-Kak Dong-gu, KR 2 4
Sung, Shijin Iksan-si, KR 1 2

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