STRUCTURE BODY AND ELECTRONIC COMPONENT AND PRINTED WIRING BOARD INCLUDING THE SAME

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United States of America Patent

APP PUB NO 20130192873A1
SERIAL NO

13678107

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Abstract

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This structure body includes a conductor comprising Cu as a main component, an intermediate layer formed on the conductor, and a protective layer formed on the intermediate layer, the intermediate layer includes at least Cu, Sn, Ni, and P, and the protective layer includes at least Ni and P.

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Patent Owner(s)

Patent OwnerAddress
TDK CORPORATION2-5-1 NIHONBASHI CHUO-KU TOKYO 103-6128

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HORIKAWA, Yuhei Tokyo, JP 31 84
ITO, Noboru Tokyo, JP 59 691
ORIKASA, Makoto Tokyo, JP 31 65
SEIKE, Hideyuki Tokyo, JP 11 51
YOSHIDA, Kenichi Tokyo, JP 199 2152

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