Electronics Packaging Assembly with Dielectric Cover
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
Aug 1, 2013
app pub date -
Jan 11, 2013
filing date -
Jan 12, 2012
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An electronics package assembly includes a housing having an opening and defining an internal cavity. The electronic package assembly further includes a printed circuit board assembly sealing and covering the opening of the housing, the printed circuit board assembly having an internal side facing the internal cavity and an opposing external side. The printed circuit board assembly includes a dielectric substrate and a conductive layer bonded to the dielectric substrate. The printed circuit board assembly further includes a surface-mounted electronic device electromechanically coupled to the conductive layer, the surface-mounted device positioned within the internal cavity of the housing.
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