HEATER ASSEMBLY
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United States of America Patent
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Issued Date -
Aug 22, 2013
app pub date -
Dec 14, 2012
filing date -
Feb 20, 2007
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A substrate for a heating assembly comprising a mixture of a mica material with an electrically insulating material, the substrate having a thermal coefficient of expansion that is higher than pure mica. A method of manufacturing the substrate is also disclosed.
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