WATER-SOLUBLE RESIN COMPOSITION FOR FORMING FINE PATTERNS AND METHOD OF FORMING FINE PATTERNS BY USING THE SAME

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United States of America Patent

APP PUB NO 20130216957A1
SERIAL NO

13723407

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Abstract

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The water-soluble resin composition for forming fine patterns comprises a water-soluble polymer represented by Chemical Formula 1 and a first water-soluble solvent. The composition is coated and heated on a photoresist layer having contact holes to reduce a size of the contact holes.

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Patent Owner(s)

Patent OwnerAddress
KOREA KUMHO PETROCHEMICAL CO LTD100 CHEONGGYECHEON-RO JUNG-GU SEOUL 04542

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Jeon, Jong Jin Chungcheongnam-do, KR 8 5
PARK, Sang Wook Chungcheongnam-do, KR 169 1239

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