High speed high density connector assembly
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United States of America Patent
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Feb 24, 2015
Grant Date -
Aug 22, 2013
app pub date -
Feb 20, 2013
filing date -
Feb 22, 2012
priority date (Note) -
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Abstract
An electrical connector assembly includes plural wafers that are stacked. Each wafer includes a conductive board defining plural slots therein, and plural contact modules each received in one of the slots. The conductive board is made from plastic coated with metal plating to improve shielding performance. Each of the contact modules includes a pair of contacts and an insulating holder fixing the contact pair to the conductive board. The insulating holder is differently void along the contact pairs to improve impedance.
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