RF substrate bias with high power impulse magnetron sputtering (HIPIMS)

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10692707
APP PUB NO 20130220802A1
SERIAL NO

13859854

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

An apparatus for generating sputtering of a target to produce a coating on a substrate is provided. The apparatus comprises a magnetron including a cathode and an anode. A power supply is operably connected to the magnetron and at least one capacitor is operably connected to the power supply. A first switch is also provided. The first switch operably connects the power supply to the magnetron to charge the magnetron and the first switch is configured to charge the magnetron according to a first pulse. An electrical bias device is operably connected to the substrate and configured to apply a substrate bias.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
EVATEC AGHAUPTSTRASSE 1A TRÜBBACH 9477

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kadlec, Stanislav Prague, CZ 20 244
Weichart, Jurgen Balzers, LI 28 219

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
7.5 Year Payment $3600.00 $1800.00 $900.00 Dec 23, 2027
11.5 Year Payment $7400.00 $3700.00 $1850.00 Dec 23, 2031
Fee Large entity fee small entity fee micro entity fee
Surcharge - 7.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00