Forming Method For Polymeric Laminated Wafers Comprising Different Film Materials

United States of America Patent

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Issued Date
Sep 5, 2013
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Apr 23, 2013
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Mar 4, 2005

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Abstract

A method of making a polymeric laminated wafer comprising different film materials that are softenable and formable at different softening temperatures corresponding with the film materials.

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HOYA OPTICAL LABS OF AMERICA INC	651 E CORPORATE DRIVE LEWISVILLE TX 75057

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B32B:LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA....

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Inventor Name	Address	# of filed Patents	Total Citations
Sugimura, Hideyo	North Oaks, US	31	674

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Forming Method For Polymeric Laminated Wafers Comprising Different Film Materials

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United States of America Patent

13868933

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13868933

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