DRY ETCHING APPARATUS
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United States of America Patent
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app pub date -
Apr 30, 2013
filing date -
Jul 3, 2008
priority date (Note) -
Abandoned
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Abstract
A dry etching apparatus is disclosed, which is capable of forming a uniform pattern in a substrate surface, the dry etching apparatus for etching at least one substrate through the use of plasma, comprising the at least one substrate placed on a tray inside a chamber; a susceptor, provided inside the chamber while confronting with the at least one substrate, for supplying a high-frequency power to form the plasma; a grounding part provided beneath the susceptor while being untouchable to the susceptor; and an insulating part provided between the susceptor and the grounding part.
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