MULTILAYER WIRING BOARD FOR AN ELECTRONIC DEVICE
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United States of America Patent
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app pub date -
May 17, 2013
filing date -
Jul 2, 2003
priority date (Note) -
Abandoned
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Abstract
To provide a multilayer wiring board mainly used for an electronic device, in which a bump passing through an interlayer insulating film allows for interlayer connection between plural wiring films insulated from one another with plural interlayer insulating layers. In the multilayer wiring board, a circuit element such as an electronic part, a semiconductor chip, or a passive element is accommodated in the interlayer insulating films so as to connect its terminal with the corresponding wiring film. In particular, the semiconductor chip is polished to a thickness of 50 μm or smaller, and the multilayer wiring board itself for the electronic device has the flexibility.
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