HEAT DISSIPATION MODULE AND METHOD OF USING THE HEAT DISSIPATION MODULE
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United States of America Patent
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Issued Date -
Sep 26, 2013
app pub date -
Jun 29, 2012
filing date -
Mar 26, 2012
priority date (Note) -
Abandoned
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Abstract
A heat dissipation module includes a heat sink. A plurality of grooves are defined in a bottom surface of the heat sink, a heat pipe is accommodated in each groove of the heat sink, and a heat conducting pad made of phase change material is adhered to the bottom surface of the heat sink to cover the grooves and the heat pipes. The heat conducting pad is a solid material at an ambient room temperature. When heated to a temperature higher than a transition temperature of the heat conducting pad, the heat conducting pad softens to fill spaces between the heat conducting pad, the heat sink, and the heat pipes.
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