INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SUPPORT STRUCTURE AND METHOD OF MANUFACTURE THEREOF
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United States of America Patent
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Issued Date -
Sep 26, 2013
app pub date -
Mar 22, 2012
filing date -
Mar 22, 2012
priority date (Note) -
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Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a single-layer support structure having a structure non-horizontal surface; forming a single-layer contact coplanar with the single-layer support structure, the single-layer contact having a contact non-horizontal surface; forming a single-layer insulation coplanar with the single-layer contact and horizontally between the structure non-horizontal surface and the contact non-horizontal surface; forming an upper support pad over the single-layer insulation and directly on the single-layer support structure; and mounting an integrated circuit over the upper support pad.
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