LIGHT-EMITTING DIODES, PACKAGES, AND METHODS OF MAKING
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United States of America Patent
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Issued Date -
Sep 26, 2013
app pub date -
Mar 20, 2012
filing date -
Mar 20, 2012
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A light-emitting diode (LED) element including an LED chip having a light emitting surface and at least one pad. A phosphor layer is formed on the light emitting surface and exposes the at least one pad. The phosphor layer includes a plurality of phosphor particles and a matrix. At least some of the phosphor particles have a first portion embedded in the matrix and a second portion protruding from an outer surface of the matrix. A method of forming a gel layer on an LED element includes using capillary action to draw the glue material into a space adjacent the upper surface of the chip.
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