SEMICONDUCTOR LASER DEVICE

Number of patents in Portfolio can not be more than 2000

United States of America Patent

SERIAL NO

13840004

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A semiconductor laser device comprises a base, a first conductive layer, a second conductive layer, a third conductive layer, and a semiconductor laser chip in this order, each of which has a respective emitting-side end portion. The emitting-side end portion of the first conductive layer is in a common plane with the emitting-side end portion of the base. A thickness of the second conductive layer is greater than a thickness of the first conductive layer. The emitting-side end portion of the second conductive layer is disposed inward of the emitting-end portion of the first conductive layer. The emitting-side end portion of the third conductive layer is in a common plane with the emitting-side end portion of the second conductive layer. The emitting-side end portion of the semiconductor laser chip is disposed outward of the emitting-side end portion of the third conductive layer.

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Patent Owner(s)

Patent OwnerAddress
NICHIA CORPORATION491-100 OKA KAMINAKA-CHO ANAN-SHI TOKUSHIMA 774-8601

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
FUJIMOTO, Hideyuki Anan-shi, JP 13 44
NAKAGAKI, Masatoshi Komatsushima-shi, JP 4 0

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