APPARATUS AND METHOD TREATING SUBSTRATE

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United States of America Patent

APP PUB NO 20130255728A1
SERIAL NO

13851351

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A substrate treating apparatus is provided which includes a housing which provides a space in which a process is performed; a spin head which supports and rotates a substrate; and a spray unit which sprays a fluid on the substrate. The spray unit comprises a first nozzle mistily spraying a first fluid; and second nozzle spraying a second fluid.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
SEMES CO LTDSOUTH KOREA CHUNGNAM CHEONAN CITY NORTHWEST JISHAN CITY FOUR FIVE STREET NO 77 CHEONAN JEOLLANAM-DO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
NOH, Hwan Ik Cheonan-si, KR 2 11

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