Substrate processing method and substrate processing apparatus
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United States of America Patent
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Nov 11, 2014
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app pub date -
Nov 28, 2012
filing date -
Mar 29, 2012
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Abstract
A substrate processing method includes a water removing step of removing water from a substrate, a silylating step of supplying a silylating agent to the substrate after the water removing step, and an etching step of supplying an etching agent to the substrate after the silylating step. The substrate may have a surface on which a nitride film and an oxide film are exposed and in this case, the etching step may be a selective etching step of selectively etching the nitride film by the etching agent. The etching agent may be supplied in a form of a vapor having an etching component.
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