SOLDER-JET NOZZLE, LASER-SOLDERING TOOL, AND METHOD, FOR LASERSOLDERING HEAD-CONNECTION PADS OF A HEAD-STACK ASSEMBLY FOR A HARD-DISK DRIVE
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United States of America Patent
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Issued Date -
Oct 3, 2013
app pub date -
Mar 30, 2012
filing date -
Mar 30, 2012
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A solder-jet nozzle for laser-soldering head-connection pads of a head-stack assembly (HSA) for a hard-disk drive (HDD). The solder-jet nozzle includes a body, a central duct, and an outer surface of the body. The body includes a tip configured to deliver a solder ball in proximity to head-connection pads of a head-gimbal assembly (HGA) of the HSA. The central duct is configured to convey the solder ball to the tip. The outer surface of the body includes a first portion, and at least a first flat. The first portion substantially coincides with a conical surface of a cone with axis disposed about along the central axis of the body. The first flat, which is parallel to the central axis, is contiguous with the first portion, and intersects the conical surface of the cone. A laser-soldering tool and a method, for laser-soldering head-connection pads of the HSA are also provided.
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