ELECTRONIC COMPONENT MODULE AND METHOD OF MANUFACTURING THE SAME
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United States of America Patent
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Issued Date -
Oct 3, 2013
app pub date -
Mar 28, 2013
filing date -
Mar 29, 2012
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
An electromagnetic component module includes: a molding resin provided so as to cover electronic components mounted on a substrate and a surface of the substrate; and a conductive shield formed so as to further cover the molding resin. The conductive shield includes a first filler and a second filler which are different from each other and the conductive shield is connected to ground wires exposed on lateral surfaces of the substrate. The average particle diameter of the first filler is ½ or less of the thickness of the ground wires and the second filler forms a metallic bond in the temperature range of 250 degrees Celsius or lower.
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