ROTATED SEMICONDUCTOR DEVICE FAN-OUT WAFER LEVEL PACKAGES AND METHODS OF MANUFACTURING ROTATED SEMICONDUCTOR DEVICE FAN-OUT WAFER LEVEL PACKAGES
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United States of America Patent
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Issued Date -
Oct 3, 2013
app pub date -
Mar 27, 2012
filing date -
Mar 27, 2012
priority date (Note) -
Abandoned
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Abstract
In various aspects of the disclosure, a package may be provided. The package may include at least one semiconductor device rotated about an axis with respect to an edge of the package, at least one bond pad on each semiconductor device, and at least one conductive trace electrically connected to the semiconductor device through the at least one bond pad.
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