Copper Sphere Array Package
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United States of America Patent
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N/A
Issued Date -
Oct 3, 2013
app pub date -
Mar 27, 2013
filing date -
Apr 3, 2012
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Presented is a method for fabricating a semiconductor package, and the associated semiconductor package. The method includes providing a compliant coverlay having a resin film disposed thereon. A plurality of metallic spheres may be placed at predetermined positions in the resin film. A top surface and a bottom surface of the metallic spheres may be flattened. Tamp blocks on opposing sides of the metallic spheres may be used. The resin film may then be cured to permanently set the metallic spheres in the resin film, and the compliant overlay may then be removed. A semiconductor die may then be placed on the plurality of metallic spheres. An encapsulating layer may then be deposited over the semiconductor die, the plurality of metallic spheres, and the resin film. The semiconductor package may then be diced. The method does not include fabricating a metal leadframe for the semiconductor die.
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