PHOTOCURABLE RESIN COMPOSITION, DRY FILM, CURED PRODUCT AND PRINTED WIRING BOARD

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United States of America Patent

APP PUB NO 20130260109A1
SERIAL NO

13827072

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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[Problems] The present invention provides a photocurable resin composition having excellent adhesion with a substrate and excellent resolution; a film obtained by using the photocurable resin composition; a cured product obtained by curing the photocurable resin composition; and a printed wiring board comprising the cured product.

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Patent Owner(s)

Patent OwnerAddress
TAIYO INK MFG CO LTDNERIMA-KU TOKYO 176-8508

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Akiyama, Manabu Hiki-gun, JP 3 8
Minegishi, Shoji Hiki-gun, JP 13 58
Shibasaki, Yoko Hiki-gun, JP 10 43

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