FLOOR SEAMING COMPOUND AND METHOD OF SEALING FLOORING SEAMS

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United States of America Patent

APP PUB NO 20130269857A1
SERIAL NO

13444501

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Abstract

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A composition for sealing flooring seams, including a water-based adhesive and a pigmented compound with a viscosity high enough that the composition may be applied vertically without significantly running and low enough that the composition will enter the opening of a seam gap. A method of sealing a seam between adjacent flooring sheets, including dispensing a sealing composition directly on the seam, waiting a sufficient time for the sealing composition to cure, and removing any excess sealing composition so that the filled seam is level with the flooring sheets.

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Patent Owner(s)

Patent OwnerAddress
ABE TAKASHINot Provided

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Abe, Takashi Palos Verdes, US 355 3021
Kajiya, Hiroshi Fukuoka City, JP 8 151

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