SYSTEM AND METHODS FOR WIRE BONDING

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United States of America Patent

APP PUB NO 20130270701A1
SERIAL NO

13539269

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A semiconductor package comprises a bond pad formed on a first semiconductor die, a surface of the bond pad exposed through an opening in a passivation layer on the first semiconductor die; a raised conductive area formed on top of a passivation layer on a second semiconductor die; and a bond wire having a first end coupled to the bond pad via a ball bond and a second end coupled directly to a surface of the raised conductive area via a stitch bond. The raised conductive area is comprised of a plurality of metal layers, each of the metal layers comprised of a respective material and having a respective thickness. The thickness and material of at least one of the plurality of metal layers is selected such that a hardness of the raised conductive area is at least as hard as a hardness of the bond wire.

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Patent Owner(s)

Patent OwnerAddress
INTERSIL AMERICAS LLCMILPITAS CA 95035

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cruz, Randolph West Melbourne, US 25 132
Kelkar, Nikhil Vishwanath Saratoga, US 32 532

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