Wiring substrate with filled vias to accommodate custom terminals
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United States of America Patent
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-
Dec 20, 2016
Grant Date -
Oct 17, 2013
app pub date -
Apr 3, 2013
filing date -
Apr 13, 2012
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A probe card assembly and associated processes of forming them may include a wiring substrate with a first surface and an opposite surface, an electrically conductive first via comprising electrically conductive material extending into the wiring substrate from the opposite surface and ending before reaching the first surface, and a plurality of electrically conductive second vias, and a custom electrically conductive terminal disposed on the first surface such that said custom terminal covers the first via and contacts one of the second vias adjacent to said first via without electrically contacting the first via. Each of the second vias may be electrically conductive from the first surface to the opposite surface. The first via may include electrically insulating material disposed within a hole in the first via.
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