Laminate Structure for a Chip Card and Method for the Production Thereof
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United States of America Patent
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Issued Date -
Oct 24, 2013
app pub date -
Feb 17, 2011
filing date -
Mar 15, 2010
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
The invention relates to a laminate structure (30) for a chip card (31), comprising a base layer (35), a chip module (32) accommodated at least partially in the base layer, and at least one cover layer (39) that covers the base layer, wherein an intermediate space (61) formed between the chip module and the cover layer as well as between the chip module and the base layer is filled with an adhesive material, wherein the adhesive material generates adhesive forces with respect to the wetted surfaces of the base layer and of the cover layer and generates adhesive forces with respect to the wetted surfaces of the chip module as well.
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