APPARATUS AND METHOD FOR CLEANING SUBSTRATES
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United States of America Patent
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Issued Date -
Oct 31, 2013
app pub date -
Apr 30, 2013
filing date -
Apr 30, 2012
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The substrate cleaning apparatus includes a first process chamber in which a liquid treating process is performed on a substrate by supplying a treating solution, a second process chamber in which a drying process is performed on the substrate, and a carrying unit carrying the substrate between the first process chamber and the second process chamber. The first process chamber includes a liquid treating housing providing a space in which the liquid treating process is performed on the substrate, a spin chuck supporting the substrate within the liquid treating housing, and a liquid supply member supplying the treating solution onto the substrate supported by the spin chuck. The second process chamber includes a drying housing providing a space in which the substrate is dried, a substrate support member supporting the substrate within the drying housing, and a heater heating the substrate.

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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
SEMES CO LTD | 77 4SANDAN 5-GIL JIKSAN-EUP SEOBUK-GU CHEONAN-SI CHUNGCHEONGNAM-DO 31040 |
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
KANG, BYUNG MAN | CHUNGCHEONGNAM-DO, KR | 10 | 19 |
KIM, YEON JOON | CHUNGCHEONGNAM-DO, KR | 3 | 8 |
KIM, YU HWAN | INCHEON, KR | 9 | 32 |
OH, SE HOON | CHUNGCHEONGNAM-DO, KR | 41 | 129 |
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Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
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