METHOD FOR MANUFACTURING ELECTRONIC DEVICES
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United States of America Patent
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N/A
Issued Date -
Oct 31, 2013
app pub date -
Apr 9, 2013
filing date -
Apr 27, 2012
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A support structure includes a support cell with a support substrate, junction sacrificial portions surrounding the support substrate, and pin blocks extending from the junction sacrificial portion toward the support substrate. A semiconductor chip is mounted to the support substrate and electrically wire bonded to the pin blocks. An encapsulating body covers the chip, with the pin blocks extending from the body. A transversal groove is formed in each pin block. Surfaces of the pin block and groove are electroplated with solder material. Each pin block is sectioned at the groove to define a pin having a first end corresponding to a portion of the groove surface of the groove and a second end corresponding to the sectioned portion of the pin block that is not electroplated with solder material. Sectioning causes the separation of the chip-insulating body assembly from the junction sacrificial portions.
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